Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
Modeling of the Punch-Through Effect in Normally-On SiC JFET used in High Temperature Inverter for Aerospace Application
Modeling of the Punch-Through Effect in Normally-On SiC JFET used in High Temperature Inverter for Aerospace Application
Dubois, Fabien, Hervé Morel, Dominique Bergogne, and Régis Meuret. 2012. “Modeling of the Punch-Through Effect in Normally-On SiC JFET Used in High Temperature Inverter for Aerospace Application.” IMAPSource Proceedings 2012 (HITEC): 154–61. https://doi.org/10.4071/HITEC-2012-WA14.
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