ISSN 2380-4505
Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
Modeling of the Punch-Through Effect in Normally-On SiC JFET used in High Temperature Inverter for Aerospace Application
Modeling of the Punch-Through Effect in Normally-On SiC JFET used in High Temperature Inverter for Aerospace Application
Fabien Dubois, Hervé Morel, Dominique Bergogne, Régis Meuret,
Dubois, Fabien, Hervé Morel, Dominique Bergogne, and Régis Meuret. 2012. “Modeling of the Punch-Through Effect in Normally-On SiC JFET Used in High Temperature Inverter for Aerospace Application.” IMAPSource Proceedings 2012 (HITEC): 154–61. https://doi.org/10.4071/HITEC-2012-WA14.