Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
Investigation of Photo-Imageable Thick Film Metallization on Low Temperature Cofired Ceramics (LTCC) for Improved Packaging Density
Investigation of Photo-Imageable Thick Film Metallization on Low Temperature Cofired Ceramics (LTCC) for Improved Packaging Density
Zhenzhen Shen, R. Wayne Johnson, Tan Zhang, David Shaddock,
Shen, Zhenzhen, R. Wayne Johnson, Tan Zhang, and David Shaddock. 2012. “Investigation of Photo-Imageable Thick Film Metallization on Low Temperature Cofired Ceramics (LTCC) for Improved Packaging Density.” IMAPSource Proceedings 2012 (HITEC): 167–72. https://doi.org/10.4071/HITEC-2012-WA21.