Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
Reliability of electronics assembled using SAC + Zn solder pastes
Reliability of electronics assembled using SAC + Zn solder pastes
H.R. Kotadia, A. Panneerselvam, M.A. Green, M.P. Clode, S.H. Mannan, H. Steen,
Kotadia, H.R., A. Panneerselvam, M.A. Green, M.P. Clode, S.H. Mannan, and H. Steen. 2012. “Reliability of Electronics Assembled Using SAC + Zn Solder Pastes.” IMAPSource Proceedings 2012 (HITEC): 51–57. https://doi.org/10.4071/HITEC-2012-TA24.