Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
Transient Liquid Phase Soldering for lead-free joining of power electronic modules in high temperature applications
Transient Liquid Phase Soldering for lead-free joining of power electronic modules in high temperature applications
Christian Ehrhardt, Matthias Hutter, Hermann Oppermann, Klaus-Dieter Lang,
Ehrhardt, Christian, Matthias Hutter, Hermann Oppermann, and Klaus-Dieter Lang. 2012. “Transient Liquid Phase Soldering for Lead-Free Joining of Power Electronic Modules in High Temperature Applications.” IMAPSource Proceedings 2012 (HITEC): 25–33. https://doi.org/10.4071/HITEC-2012-TA21.