Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability
Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability
Satoshi Tanimoto, Kohei Matsui, Yusuke Zushi, Shinji Sato, Yoshinori Murakami, Masato Takamori, Takashi Iseki,
Tanimoto, Satoshi, Kohei Matsui, Yusuke Zushi, Shinji Sato, Yoshinori Murakami, Masato Takamori, and Takashi Iseki. 2012. “Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability.” IMAPSource Proceedings 2012 (HITEC): 110–16. https://doi.org/10.4071/HITEC-2012-TP22.