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High Temperature Conference Papers
Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT

Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability

Satoshi Tanimoto, Kohei Matsui, Yusuke Zushi, Shinji Sato, Yoshinori Murakami, Masato Takamori, Takashi Iseki,
High temperaturePower deviceSiCAu-GeDie attachmentCeramic substrate
https://doi.org/10.4071/HITEC-2012-TP22
IMAPSource Conference Papers
Tanimoto, Satoshi, Kohei Matsui, Yusuke Zushi, Shinji Sato, Yoshinori Murakami, Masato Takamori, and Takashi Iseki. 2012. “Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability.” IMAPSource Proceedings 2012 (HITEC): 110–16. https:/​/​doi.org/​10.4071/​HITEC-2012-TP22.
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