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High Temperature Conference Papers
Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT

Recent Progress in Thin Film Multichip Packaging for High Temperature Digital Electronics

Kun Fang, Tami Isaacs-Smith, R. Wayne Johnson, Alexey Vert, Tan Zhang, David Shaddock,
High temperature electronicsThin film modules
https://doi.org/10.4071/HITEC-THP23
IMAPSource Conference Papers
Fang, Kun, Tami Isaacs-Smith, R. Wayne Johnson, Alexey Vert, Tan Zhang, and David Shaddock. 2012. “Recent Progress in Thin Film Multichip Packaging for High Temperature Digital Electronics.” IMAPSource Proceedings 2012 (HITEC): 407–12. https:/​/​doi.org/​10.4071/​HITEC-THP23.
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