Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
Recent Progress in Thin Film Multichip Packaging for High Temperature Digital Electronics
Recent Progress in Thin Film Multichip Packaging for High Temperature Digital Electronics
Kun Fang, Tami Isaacs-Smith, R. Wayne Johnson, Alexey Vert, Tan Zhang, David Shaddock,
Fang, Kun, Tami Isaacs-Smith, R. Wayne Johnson, Alexey Vert, Tan Zhang, and David Shaddock. 2012. “Recent Progress in Thin Film Multichip Packaging for High Temperature Digital Electronics.” IMAPSource Proceedings 2012 (HITEC): 407–12. https://doi.org/10.4071/HITEC-THP23.