Recent Progress in Thin Film Multichip Packaging for High Temperature Digital Electronics

Kun Fang; Tami Isaacs-Smith; R. Wayne Johnson; Alexey Vert; Tan Zhang; David Shaddock

doi:10.4071/HITEC-THP23

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Fang, Kun, Tami Isaacs-Smith, R. Wayne Johnson, Alexey Vert, Tan Zhang, and David Shaddock. 2012. “Recent Progress in Thin Film Multichip Packaging for High Temperature Digital Electronics.” IMAPSource Proceedings 2012 (HITEC): 407–12. https://doi.org/10.4071/HITEC-THP23.

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