Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
Highly Reliable Double-sided Bonding used in Double-sided Cooling for High Temperature Power Electronics
Highly Reliable Double-sided Bonding used in Double-sided Cooling for High Temperature Power Electronics
Sang Won Yoon, Michael D. Glover, H. Alan Mantooth, Koji Shiozaki,
Yoon, Sang Won, Michael D. Glover, H. Alan Mantooth, and Koji Shiozaki. 2012. “Highly Reliable Double-Sided Bonding Used in Double-Sided Cooling for High Temperature Power Electronics.” IMAPSource Proceedings 2012 (HITEC): 45–50. https://doi.org/10.4071/HITEC-2012-TA23.