Highly Reliable Double-sided Bonding used in Double-sided Cooling for High Temperature Power Electronics

Sang Won Yoon; Michael D. Glover; H. Alan Mantooth; Koji Shiozaki

doi:10.4071/HITEC-2012-TA23

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Yoon, Sang Won, Michael D. Glover, H. Alan Mantooth, and Koji Shiozaki. 2012. “Highly Reliable Double-Sided Bonding Used in Double-Sided Cooling for High Temperature Power Electronics.” IMAPSource Proceedings 2012 (HITEC): 45–50. https://doi.org/10.4071/HITEC-2012-TA23.

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