ISSN 2380-4505
Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
High-Temperature Reliability of Direct-Bond-Copper Substrates with Sealed Edges
High-Temperature Reliability of Direct-Bond-Copper Substrates with Sealed Edges
Yiying Yao, Zheng Chen, Dushan Boroyevich, Khai D. T. Ngo,
Yao, Yiying, Zheng Chen, Dushan Boroyevich, and Khai D. T. Ngo. 2012. “High-Temperature Reliability of Direct-Bond-Copper Substrates with Sealed Edges.” IMAPSource Proceedings 2012 (HITEC): 1–5. https://doi.org/10.4071/HITEC-2012-WA23.