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High Temperature Conference Papers
Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT

Analog Component Development for 300°C Sensor Interface Applications

Bruce W. Ohme, Mark R. Larson,
High Temperature Electronics High Temperature SOI CMOS High Temperature Reliability
• https://doi.org/10.4071/HITEC-2012-WP11
IMAPSource Conference Papers
Ohme, Bruce W., and Mark R. Larson. 2012. “Analog Component Development for 300°C Sensor Interface Applications.” IMAPSource Proceedings 2012 (HITEC): 199–206. https://doi.org/10.4071/HITEC-2012-WP11.
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