Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
High Temperature Conference Papers
Vol. 2012, Issue HITEC, 2012
January 01, 2012 EDT
Analog Component Development for 300°C Sensor Interface Applications
Bruce W. Ohme
,
Mark R. Larson
,
High Temperature Electronics
High Temperature SOI CMOS
High Temperature Reliability
•
https://doi.org/10.4071/HITEC-2012-WP11
IMAPSource Conference Papers
Ohme, Bruce W., and Mark R. Larson. 2012. “Analog Component Development for 300°C Sensor Interface Applications.”
IMAPSource Proceedings
2012 (HITEC): 199–206.
https://doi.org/10.4071/HITEC-2012-WP11
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats