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High Temperature Conference Papers
Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT

SLID Bonding for Energy Dense Applications – Thermo-Mechanics

Andreas Larsson, Torleif André Tollefsen,
Advanced packaging materials High temperature SLID bonding finite element analysis (FEA)
• https://doi.org/10.4071/HITEC-2012-TP21
IMAPSource Conference Papers
Larsson, Andreas, and Torleif André Tollefsen. 2012. “SLID Bonding for Energy Dense Applications – Thermo-Mechanics.” IMAPSource Proceedings 2012 (HITEC): 104–9. https://doi.org/10.4071/HITEC-2012-TP21.
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