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High Temperature Conference Papers
Vol. 2012, Issue HITEC, 2012
January 01, 2012 EDT
SLID Bonding for Energy Dense Applications – Thermo-Mechanics
Andreas Larsson
,
Torleif André Tollefsen
,
Advanced packaging materials
High temperature
SLID bonding
finite element analysis (FEA)
•
https://doi.org/10.4071/HITEC-2012-TP21
IMAPSource Conference Papers
Larsson, Andreas, and Torleif André Tollefsen. 2012. “SLID Bonding for Energy Dense Applications – Thermo-Mechanics.”
IMAPSource Proceedings
2012 (HITEC): 104–9.
https://doi.org/10.4071/HITEC-2012-TP21
.
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