Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
Microstructural Evolution and Thermal Stability Characterization of a High Temperature Die Attach Lead-Free System
Microstructural Evolution and Thermal Stability Characterization of a High Temperature Die Attach Lead-Free System
Rogie I. Rodriguez, Dimeji Ibitayo, Pedro Quintero,
Rodriguez, Rogie I., Dimeji Ibitayo, and Pedro Quintero. 2012. “Microstructural Evolution and Thermal Stability Characterization of a High Temperature Die Attach Lead-Free System.” IMAPSource Proceedings 2012 (HITEC): 1–11. https://doi.org/10.4071/HITEC-TA22.