Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics
Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics
M. Mirgkizoudi, C. Liu, P. Conway, S. Riches,
Mirgkizoudi, M., C. Liu, P. Conway, and S. Riches. 2012. “Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics.” IMAPSource Proceedings 2012 (HITEC): 335–44. https://doi.org/10.4071/HITEC-2012-THA22.