Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics

M. Mirgkizoudi; C. Liu; P. Conway; S. Riches

doi:10.4071/HITEC-2012-THA22

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Mirgkizoudi, M., C. Liu, P. Conway, and S. Riches. 2012. “Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics.” IMAPSource Proceedings 2012 (HITEC): 335–44. https://doi.org/10.4071/HITEC-2012-THA22.

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