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Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012
January 01, 2012 EDT
Development of Lead Free Plating Chemical for Various Applications
Takeshi Hatta
,
Atsushi Ishikawa
,
Takuma Katase
,
Akihiro Masuda
,
Lead Free Plating Chemical
Solder Bumping
3D assembly
•
https://doi.org/10.4071/2012DPC-tp22
IMAPSource Conference Papers
Hatta, Takeshi, Atsushi Ishikawa, Takuma Katase, and Akihiro Masuda. 2012. “Development of Lead Free Plating Chemical for Various Applications.”
IMAPSource Proceedings
2012 (DPC): 944–67.
https://doi.org/10.4071/2012DPC-tp22
.
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