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Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012
January 01, 2012 EDT
New Advances in 3D/2.5D Integration
Robert Patti
,
Memory
Interposer
3D
•
https://doi.org/10.4071/2012DPC-tha12
IMAPSource Conference Papers
Patti, Robert. 2012. “New Advances in 3D/2.5D Integration.”
IMAPSource Proceedings
2012 (DPC): 2135–67.
https://doi.org/10.4071/2012DPC-tha12
.
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