Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Laser Processing and Integration for Si Interposers and 3D Packaging Applications
Laser Processing and Integration for Si Interposers and 3D Packaging Applications
Matthew Knowles, Andy Hooper, Kip Pettigrew,
Knowles, Matthew, Andy Hooper, and Kip Pettigrew. 2012. “Laser Processing and Integration for Si Interposers and 3D Packaging Applications.” IMAPSource Proceedings 2012 (DPC): 1783–1806. https://doi.org/10.4071/2012DPC-wp15.