Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
2.5D and 3D Packaging Enables Effective Multi-Chip Packaging
2.5D and 3D Packaging Enables Effective Multi-Chip Packaging
Phil Marcoux,
Marcoux, Phil. 2012. “2.5D and 3D Packaging Enables Effective Multi-Chip Packaging.” IMAPSource Proceedings 2012 (DPC): 398–424. https://doi.org/10.4071/2012DPC-ta14.