ISSN 2380-4505
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Reduced Temperature Metal Based Bonding Processes for Wafer Level Packaging and 3D Integration
Reduced Temperature Metal Based Bonding Processes for Wafer Level Packaging and 3D Integration
Eric F. Pabo, Viorel Dragoi, Tian Tang, Thorsten Matthias,
Pabo, Eric F., Viorel Dragoi, Tian Tang, and Thorsten Matthias. 2012. “Reduced Temperature Metal Based Bonding Processes for Wafer Level Packaging and 3D Integration.” IMAPSource Proceedings 2012 (DPC): 2509–42. https://doi.org/10.4071/2012DPC-tha33.