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Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT

Thermal Challenges in 3D Stacks

Susheela Narasimhan, Herman Chu, Mudasir Ahmad, Li Li,
3D Memory Stacks3D PackagingTelecom Applications
https://doi.org/10.4071/2012DPC-wa11
IMAPSource Conference Papers
Narasimhan, Susheela, Herman Chu, Mudasir Ahmad, and Li Li. 2012. “Thermal Challenges in 3D Stacks.” IMAPSource Proceedings 2012 (DPC): 1354–72. https:/​/​doi.org/​10.4071/​2012DPC-wa11.
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