Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Thermal Cycling Analysis of BGA Solder Joint Reliability
Thermal Cycling Analysis of BGA Solder Joint Reliability
Betty H. Yeung, Torsten Hauck, Brett Wilkerson, Thomas Koschmieder,
Yeung, Betty H., Torsten Hauck, Brett Wilkerson, and Thomas Koschmieder. 2012. “Thermal Cycling Analysis of BGA Solder Joint Reliability.” IMAPSource Proceedings 2012 (DPC): 542–53. https://doi.org/10.4071/2012DPC-ta21.