Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:54963/feed
Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT

Thermal Cycling Analysis of BGA Solder Joint Reliability

Betty H. Yeung, Torsten Hauck, Brett Wilkerson, Thomas Koschmieder,
flip chipthermal cyclingsolder joint reliability
https://doi.org/10.4071/2012DPC-ta21
IMAPSource Conference Papers
Yeung, Betty H., Torsten Hauck, Brett Wilkerson, and Thomas Koschmieder. 2012. “Thermal Cycling Analysis of BGA Solder Joint Reliability.” IMAPSource Proceedings 2012 (DPC): 542–53. https:/​/​doi.org/​10.4071/​2012DPC-ta21.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system