Thermal Cycling Analysis of BGA Solder Joint Reliability

Betty H. Yeung; Torsten Hauck; Brett Wilkerson; Thomas Koschmieder

doi:10.4071/2012DPC-ta21

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Yeung, Betty H., Torsten Hauck, Brett Wilkerson, and Thomas Koschmieder. 2012. “Thermal Cycling Analysis of BGA Solder Joint Reliability.” IMAPSource Proceedings 2012 (DPC): 542–53. https://doi.org/10.4071/2012DPC-ta21.

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