ISSN 2380-4505
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Super Fine Lead-Free Solder Powder for Fine Pitch Bump Applications
Super Fine Lead-Free Solder Powder for Fine Pitch Bump Applications
Ryuji Uesugi, Hironori Uno, Masayuki Ishikawa, Akihiro Masuda, Hiroki Muraoka, Yousuke Kawamura, Sho Nakagawa, Kanji Kuba,
Uesugi, Ryuji, Hironori Uno, Masayuki Ishikawa, Akihiro Masuda, Hiroki Muraoka, Yousuke Kawamura, Sho Nakagawa, and Kanji Kuba. 2012. “Super Fine Lead-Free Solder Powder for Fine Pitch Bump Applications.” IMAPSource Proceedings 2012 (DPC): 1016–38. https://doi.org/10.4071/2012DPC-tp26.