Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012
January 01, 2012 EDT
Improvement of Plated Copper Adhesion in Glass Interposer Applications
Simon Bamberg
,
Vijay Sukumaran
,
Venky Sundaram
,
Rao Tummala
,
Johannes Etzkorn
,
Frank Brüning
,
Glass interposer
Chemical copper metallization
Adhesion improvement
•
https://doi.org/10.4071/2012DPC-wp16
IMAPSource Conference Papers
Bamberg, Simon, Vijay Sukumaran, Venky Sundaram, Rao Tummala, Johannes Etzkorn, and Frank Brüning. 2012. “Improvement of Plated Copper Adhesion in Glass Interposer Applications.”
IMAPSource Proceedings
2012 (DPC): 1807–26.
https://doi.org/10.4071/2012DPC-wp16
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats