Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Improvement of Plated Copper Adhesion in Glass Interposer Applications
Improvement of Plated Copper Adhesion in Glass Interposer Applications
Simon Bamberg, Vijay Sukumaran, Venky Sundaram, Rao Tummala, Johannes Etzkorn, Frank Brüning,
Bamberg, Simon, Vijay Sukumaran, Venky Sundaram, Rao Tummala, Johannes Etzkorn, and Frank Brüning. 2012. “Improvement of Plated Copper Adhesion in Glass Interposer Applications.” IMAPSource Proceedings 2012 (DPC): 1807–26. https://doi.org/10.4071/2012DPC-wp16.