Improvement of Plated Copper Adhesion in Glass Interposer Applications

Simon Bamberg; Vijay Sukumaran; Venky Sundaram; Rao Tummala; Johannes Etzkorn; Frank Brüning

doi:10.4071/2012DPC-wp16

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Bamberg, Simon, Vijay Sukumaran, Venky Sundaram, Rao Tummala, Johannes Etzkorn, and Frank Brüning. 2012. “Improvement of Plated Copper Adhesion in Glass Interposer Applications.” IMAPSource Proceedings 2012 (DPC): 1807–26. https://doi.org/10.4071/2012DPC-wp16.

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