Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Pre-Applied Underfill (PAUF) for Fine Pitch Flip Chip 3D Chip Stacking
Pre-Applied Underfill (PAUF) for Fine Pitch Flip Chip 3D Chip Stacking
Anupam Choubey, E. Anzures, A. Dhoble, D. Fleming, M. Gallagher, I. Lee, M. Oliver, Y. Qin, C. Truong, Z. Wang, J. Woertink,
Choubey, Anupam, E. Anzures, A. Dhoble, D. Fleming, M. Gallagher, I. Lee, M. Oliver, et al. 2012. “Pre-Applied Underfill (PAUF) for Fine Pitch Flip Chip 3D Chip Stacking.” IMAPSource Proceedings 2012 (DPC): 1432–51. https://doi.org/10.4071/2012DPC-wa14.