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Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012
January 01, 2012 EDT
Gold Stud Bump on Sn Based Solders
Terence Q. Collier
,
gold stud bump
flip chip
UBM
•
https://doi.org/10.4071/2012DPC-wp24
IMAPSource Conference Papers
Collier, Terence Q. 2012. “Gold Stud Bump on Sn Based Solders.”
IMAPSource Proceedings
2012 (DPC): 1870–94.
https://doi.org/10.4071/2012DPC-wp24
.
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