Temperature Cycling Induced Warpage of Packages with Embedded Copper Heatspreaders

Matthew Stahley; John Osenbach; Brenda Gogue; Byong Il Heo; Byung Cheol Lee; Dongmei Meng

doi:10.4071/2012DPC-wa25

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Stahley, Matthew, John Osenbach, Brenda Gogue, Byong Il Heo, Byung Cheol Lee, and Dongmei Meng. 2012. “Temperature Cycling Induced Warpage of Packages with Embedded Copper Heatspreaders.” IMAPSource Proceedings 2012 (DPC): 1579–96. https://doi.org/10.4071/2012DPC-wa25.

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