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Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012
January 01, 2012 EDT
Temperature Cycling Induced Warpage of Packages with Embedded Copper Heatspreaders
Matthew Stahley
,
John Osenbach
,
Brenda Gogue
,
Byong Il Heo
,
Byung Cheol Lee
,
Dongmei Meng
,
Temperature Cycling
Leadfree
Warpage
•
https://doi.org/10.4071/2012DPC-wa25
IMAPSource Conference Papers
Stahley, Matthew, John Osenbach, Brenda Gogue, Byong Il Heo, Byung Cheol Lee, and Dongmei Meng. 2012. “Temperature Cycling Induced Warpage of Packages with Embedded Copper Heatspreaders.”
IMAPSource Proceedings
2012 (DPC): 1579–96.
https://doi.org/10.4071/2012DPC-wa25
.
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