Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Temperature Cycling Induced Warpage of Packages with Embedded Copper Heatspreaders
Temperature Cycling Induced Warpage of Packages with Embedded Copper Heatspreaders
Matthew Stahley, John Osenbach, Brenda Gogue, Byong Il Heo, Byung Cheol Lee, Dongmei Meng,
Stahley, Matthew, John Osenbach, Brenda Gogue, Byong Il Heo, Byung Cheol Lee, and Dongmei Meng. 2012. “Temperature Cycling Induced Warpage of Packages with Embedded Copper Heatspreaders.” IMAPSource Proceedings 2012 (DPC): 1579–96. https://doi.org/10.4071/2012DPC-wa25.