Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Advanced Substrate Applied Fluxing Underfill for Bonding of Fine Pitch Solder Capped Cu Pillars to Oxidized Cu Substrates
Advanced Substrate Applied Fluxing Underfill for Bonding of Fine Pitch Solder Capped Cu Pillars to Oxidized Cu Substrates
Russell Stapleton, Jim Greig,
Stapleton, Russell, and Jim Greig. 2012. “Advanced Substrate Applied Fluxing Underfill for Bonding of Fine Pitch Solder Capped Cu Pillars to Oxidized Cu Substrates.” IMAPSource Proceedings 2012 (DPC): 924–43. https://doi.org/10.4071/2012DPC-tp21.