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Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT

High Density Attachment of HB-LED Die to Heat Sink Surfaces Using Aerosol Jet Printing

Kurt K. Christenson, Michael J. Renn, Jason A. Paulsen, Justin J. Bourassa, Kelley M. McDonald,
Aerosol Jet heat direct attach
• https://doi.org/10.4071/2012DPC-wa33
IMAPSource Conference Papers
Christenson, Kurt K., Michael J. Renn, Jason A. Paulsen, Justin J. Bourassa, and Kelley M. McDonald. 2012. “High Density Attachment of HB-LED Die to Heat Sink Surfaces Using Aerosol Jet Printing.” IMAPSource Proceedings 2012 (DPC): 1628–46. https://doi.org/10.4071/2012DPC-wa33.
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