Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Large Die Size Lead Free Flip Chip Ball Grid Array Packaging Considerations for 40nm Fab Technology
Large Die Size Lead Free Flip Chip Ball Grid Array Packaging Considerations for 40nm Fab Technology
Mark A. Bachman, Jerry Liao, John Osenbach, Zafer Kutlu, Jaeyun Gim, Danny Brady,
Bachman, Mark A., Jerry Liao, John Osenbach, Zafer Kutlu, Jaeyun Gim, and Danny Brady. 2012. “Large Die Size Lead Free Flip Chip Ball Grid Array Packaging Considerations for 40nm Fab Technology.” IMAPSource Proceedings 2012 (DPC): 570–85. https://doi.org/10.4071/2012DPC-ta23.