Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Through Glass Via (TGV) Solutions for Wafer and Chip level Interposers and RF Integration Methods for High Frequency Applications
Through Glass Via (TGV) Solutions for Wafer and Chip level Interposers and RF Integration Methods for High Frequency Applications
Mobley, Tim, and Vern Stygar. 2012. “Through Glass Via (TGV) Solutions for Wafer and Chip Level Interposers and RF Integration Methods for High Frequency Applications.” IMAPSource Proceedings 2012 (DPC): 1895–1919. https://doi.org/10.4071/2012DPC-wp25.
Powered by Scholastica, the modern academic journal management system