Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
3D Glass and Silicon Interposers with TPV vs. 3D ICs with TSV
3D Glass and Silicon Interposers with TPV vs. 3D ICs with TSV
Tummala, Rao. 2012. “3D Glass and Silicon Interposers with TPV vs. 3D ICs with TSV.” IMAPSource Proceedings 2012 (DPC): 757–90. https://doi.org/10.4071/2012DPC-tp11.
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