Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Assembly Challenges for Large Interposer 2.5D TSV Products
Assembly Challenges for Large Interposer 2.5D TSV Products
Marnie Mattei, Mike Kelly,
Mattei, Marnie, and Mike Kelly. 2012. “Assembly Challenges for Large Interposer 2.5D TSV Products.” IMAPSource Proceedings 2012 (DPC): 347–76. https://doi.org/10.4071/2012DPC-ta12.