Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
3D & System-in-Package Development with the Redistributed Chip Package (RCP)
3D & System-in-Package Development with the Redistributed Chip Package (RCP)
Zhiwei (Tony) Gong, Scott Hayes, Navjot Chhabra, Trung Duong, Doug Mitchell, Jason Wright, Michael Vincent,
Gong, Zhiwei (Tony), Scott Hayes, Navjot Chhabra, Trung Duong, Doug Mitchell, Jason Wright, and Michael Vincent. 2012. “3D & System-in-Package Development with the Redistributed Chip Package (RCP).” IMAPSource Proceedings 2012 (DPC): 2374–98. https://doi.org/10.4071/2012DPC-tha23.