Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT

Wafer-Level Bonding using Anisotropic Conductive Adhesive for 3D MEMS Applications

Lars G. W. Tvedt, Nicolas Lietaer, Thor Bakke, Keith Redford, Helge Kristiansen,
Wafer-level Bonding Anisotropic Conductive Adhesive Through Silicon Via
• https://doi.org/10.4071/2012DPC-tha32
IMAPSource Conference Papers
Tvedt, Lars G. W., Nicolas Lietaer, Thor Bakke, Keith Redford, and Helge Kristiansen. 2012. “Wafer-Level Bonding Using Anisotropic Conductive Adhesive for 3D MEMS Applications.” IMAPSource Proceedings 2012 (DPC): 2483–2508. https://doi.org/10.4071/2012DPC-tha32.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system