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Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT

Wafer-Level Bonding using Anisotropic Conductive Adhesive for 3D MEMS Applications

Lars G. W. Tvedt, Nicolas Lietaer, Thor Bakke, Keith Redford, Helge Kristiansen,
Wafer-level BondingAnisotropic Conductive AdhesiveThrough Silicon Via
https://doi.org/10.4071/2012DPC-tha32
IMAPSource Conference Papers
Tvedt, Lars G. W., Nicolas Lietaer, Thor Bakke, Keith Redford, and Helge Kristiansen. 2012. “Wafer-Level Bonding Using Anisotropic Conductive Adhesive for 3D MEMS Applications.” IMAPSource Proceedings 2012 (DPC): 2483–2508. https:/​/​doi.org/​10.4071/​2012DPC-tha32.
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