Wafer-Level Bonding using Anisotropic Conductive Adhesive for 3D MEMS Applications

Lars G. W. Tvedt; Nicolas Lietaer; Thor Bakke; Keith Redford; Helge Kristiansen

doi:10.4071/2012DPC-tha32

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Tvedt, Lars G. W., Nicolas Lietaer, Thor Bakke, Keith Redford, and Helge Kristiansen. 2012. “Wafer-Level Bonding Using Anisotropic Conductive Adhesive for 3D MEMS Applications.” IMAPSource Proceedings 2012 (DPC): 2483–2508. https://doi.org/10.4071/2012DPC-tha32.

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