Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Wafer-Level Bonding using Anisotropic Conductive Adhesive for 3D MEMS Applications
Wafer-Level Bonding using Anisotropic Conductive Adhesive for 3D MEMS Applications
Lars G. W. Tvedt, Nicolas Lietaer, Thor Bakke, Keith Redford, Helge Kristiansen,
Tvedt, Lars G. W., Nicolas Lietaer, Thor Bakke, Keith Redford, and Helge Kristiansen. 2012. “Wafer-Level Bonding Using Anisotropic Conductive Adhesive for 3D MEMS Applications.” IMAPSource Proceedings 2012 (DPC): 2483–2508. https://doi.org/10.4071/2012DPC-tha32.