Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
TGV Microfabrication Technology for 3D Packaging
TGV Microfabrication Technology for 3D Packaging
Shintaro Takahashi, Christian Schmidt, Leander Dittmann, Svend Hoyer, Adrien Chaize, Motoshi Ono, Kenji Kitaoka, Kentaro Tatsukoshi, Shoichi Konishi,
Takahashi, Shintaro, Christian Schmidt, Leander Dittmann, Svend Hoyer, Adrien Chaize, Motoshi Ono, Kenji Kitaoka, Kentaro Tatsukoshi, and Shoichi Konishi. 2012. “TGV Microfabrication Technology for 3D Packaging.” IMAPSource Proceedings 2012 (DPC): 811–31. https://doi.org/10.4071/2012DPC-tp13.