ISSN 2380-4505
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Study of Factors Which Influenced to Bump Shape and Voids in Bumps during Bump Formation with Solder Paste
Study of Factors Which Influenced to Bump Shape and Voids in Bumps during Bump Formation with Solder Paste
Masayuki Ishikawa, Hironori Uno, Takashi Yamaji, Ryuji Uesugi, Akihiro Masuda, Shingo Hirano, Fuyumi Mawatari, Natsuko Tanaka, Kohki Okada,
Ishikawa, Masayuki, Hironori Uno, Takashi Yamaji, Ryuji Uesugi, Akihiro Masuda, Shingo Hirano, Fuyumi Mawatari, Natsuko Tanaka, and Kohki Okada. 2012. “Study of Factors Which Influenced to Bump Shape and Voids in Bumps during Bump Formation with Solder Paste.” IMAPSource Proceedings 2012 (DPC): 2316–39. https://doi.org/10.4071/2012DPC-tha21.