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Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012
January 01, 2012 EDT
Die to Die and Die To Wafer Bonding Solution for High Density, Fine Pitch Micro-Bumped Die
Gilbert Lecarpentier
,
Joeri De Vos
,
3D integration
Flip Chip Bonding
Chip to Wafer
•
https://doi.org/10.4071/2012DPC-tha15
IMAPSource Conference Papers
Lecarpentier, Gilbert, and Joeri De Vos. 2012. “Die to Die and Die To Wafer Bonding Solution for High Density, Fine Pitch Micro-Bumped Die.”
IMAPSource Proceedings
2012 (DPC): 2251–84.
https://doi.org/10.4071/2012DPC-tha15
.
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