ISSN 2380-4505
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Die to Die and Die To Wafer Bonding Solution for High Density, Fine Pitch Micro-Bumped Die
Die to Die and Die To Wafer Bonding Solution for High Density, Fine Pitch Micro-Bumped Die
Gilbert Lecarpentier, Joeri De Vos,
Lecarpentier, Gilbert, and Joeri De Vos. 2012. “Die to Die and Die To Wafer Bonding Solution for High Density, Fine Pitch Micro-Bumped Die.” IMAPSource Proceedings 2012 (DPC): 2251–84. https://doi.org/10.4071/2012DPC-tha15.