Thin Film Packaging for Vacuum MEMS Encapsulation: A Study on Outgassing Phenomenon

D. Saint-Patrice; J. L. Pornin; B. Savornin; G. Rodriguez; S. Danthon; P. L. Charvet; P. Nicolas; S. Nicolas; S. Fanget

doi:10.4071/2012DPC-tha31

Loading [Contrib]/a11y/accessibility-menu.js

Saint-Patrice, D., J. L. Pornin, B. Savornin, G. Rodriguez, S. Danthon, P. L. Charvet, P. Nicolas, S. Nicolas, and S. Fanget. 2012. “Thin Film Packaging for Vacuum MEMS Encapsulation: A Study on Outgassing Phenomenon.” IMAPSource Proceedings 2012 (DPC): 2428–82. https://doi.org/10.4071/2012DPC-tha31.

View more stats