Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Temporary Wafer Bonding Materials and Processes
Temporary Wafer Bonding Materials and Processes
Matthew Lueck, Alan Huffman, Marianne Butler, Dorota Temple, Phil Garrou,
Lueck, Matthew, Alan Huffman, Marianne Butler, Dorota Temple, and Phil Garrou. 2012. “Temporary Wafer Bonding Materials and Processes.” IMAPSource Proceedings 2012 (DPC): 1452–76. https://doi.org/10.4071/2012DPC-wa15.