Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
NCP (Non Conductive Paste) for Narrow Gap Flip Chip Package and TSV Package
NCP (Non Conductive Paste) for Narrow Gap Flip Chip Package and TSV Package
Abe, Hidenori, Tomoya Masuda, Yuko Kondo, and Hiroshi Takahashi. 2012. “NCP (Non Conductive Paste) for Narrow Gap Flip Chip Package and TSV Package.” IMAPSource Proceedings 2012 (DPC): 1–34. https://doi.org/10.4071/2012DPC-tha22.
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