Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Low Temperature Curing - Aqueous Base Developable Photoimageable Dielectric for WLP (Wafer Level Packaging)
Low Temperature Curing - Aqueous Base Developable Photoimageable Dielectric for WLP (Wafer Level Packaging)
Eric Huenger, Joe Lachowski, Greg Prokopowicz, Ray Thibault, Michael Gallagher, Scott Kisting, Lynne Mills, Masaki Kondoh,
Huenger, Eric, Joe Lachowski, Greg Prokopowicz, Ray Thibault, Michael Gallagher, Scott Kisting, Lynne Mills, and Masaki Kondoh. 2012. “Low Temperature Curing - Aqueous Base Developable Photoimageable Dielectric for WLP (Wafer Level Packaging).” IMAPSource Proceedings 2012 (DPC): 986–1015. https://doi.org/10.4071/2012DPC-tp25.