Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Low Temperature Wafer Level Bonding Using Benzocyclobutene Adhesive Polymers
Low Temperature Wafer Level Bonding Using Benzocyclobutene Adhesive Polymers
Michael Gallagher, Jong-Uk Kim, Eric Huenger, Kai Zoschke, Christina Lopper, Michael Toepper,
Gallagher, Michael, Jong-Uk Kim, Eric Huenger, Kai Zoschke, Christina Lopper, and Michael Toepper. 2012. “Low Temperature Wafer Level Bonding Using Benzocyclobutene Adhesive Polymers.” IMAPSource Proceedings 2012 (DPC): 1–24. https://doi.org/10.4071/2012DPC-wp13.