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Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT

Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies

Robert Darveaux,
Next Generation Package Interconnect Technologies IC Package
• https://doi.org/10.4071/2012DPC-Keynote_FC_WLP_Amkor
IMAPSource Conference Papers
Darveaux, Robert. 2012. “Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies.” IMAPSource Proceedings 2012 (DPC): 1306–53. https://doi.org/10.4071/2012DPC-Keynote_FC_WLP_Amkor.
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