A Methodology for Chip - Package Interaction (CPI) Modeling in 3D IC Structures

Karthikeyan Dhandapani; Ahmer Syed; Wei Lin; Mark Nakamoto; Wei Zhao; Riko Radojcic

doi:10.4071/2012DPC-wa12

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Dhandapani, Karthikeyan, Ahmer Syed, Wei Lin, Mark Nakamoto, Wei Zhao, and Riko Radojcic. 2012. “A Methodology for Chip - Package Interaction (CPI) Modeling in 3D IC Structures.” IMAPSource Proceedings 2012 (DPC): 1373–93. https://doi.org/10.4071/2012DPC-wa12.

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