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Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT

200mm & 300mm Processes & Characterization for Face to Back Flow Chart for Wide I/O

Severine Cheramy, G. Garnier, A. Jouve, J.-P. Colonna, P. Coudrain, P. Chausse, R. Segaud, C. Aumont, N. Hotellier, C. Brunet-Manquat, C. Laviron, N. Sillon,
3D integration face to back 200 & 300mm
• https://doi.org/10.4071/2012DPC-ta13
IMAPSource Conference Papers
Cheramy, Severine, G. Garnier, A. Jouve, J.-P. Colonna, P. Coudrain, P. Chausse, R. Segaud, et al. 2012. “200mm & 300mm Processes & Characterization for Face to Back Flow Chart for Wide I/O.” IMAPSource Proceedings 2012 (DPC): 377–97. https://doi.org/10.4071/2012DPC-ta13.
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