ISSN 2380-4505
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Processing, Bumping and Assembly of Single Chip Plated Ni/Pd over ALCAP Bond Pads for Flip Chip Applications and Prototyping
Processing, Bumping and Assembly of Single Chip Plated Ni/Pd over ALCAP Bond Pads for Flip Chip Applications and Prototyping
Brian J. Lewis, Daniel F. Baldwin, Paul N. Houston, Le hang La, Tim Spark,
Lewis, Brian J., Daniel F. Baldwin, Paul N. Houston, Le hang La, and Tim Spark. 2012. “Processing, Bumping and Assembly of Single Chip Plated Ni/Pd over ALCAP Bond Pads for Flip Chip Applications and Prototyping.” IMAPSource Proceedings 2012 (DPC): 1841–69. https://doi.org/10.4071/2012DPC-wp23.