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Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT

Rigid and Flex PCB Based Microsystems for Mobility, Systems Development and Harsh Environments

David Fries, Geran Barton, Gary Hendricks, Brian Gregson, Liesl Hotaling,
systemsmobilityPCBMEMS
https://doi.org/10.4071/2012DPC-tp33
IMAPSource Conference Papers
Fries, David, Geran Barton, Gary Hendricks, Brian Gregson, and Liesl Hotaling. 2012. “Rigid and Flex PCB Based Microsystems for Mobility, Systems Development and Harsh Environments.” IMAPSource Proceedings 2012 (DPC): 1054–95. https:/​/​doi.org/​10.4071/​2012DPC-tp33.
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