Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Next Generation eWLB (Embedded Wafer Level BGA): Advanced 3D SiP Packaging Solution
Next Generation eWLB (Embedded Wafer Level BGA): Advanced 3D SiP Packaging Solution
Seung Wook Yoon, Yaojian Lin, Yonggang Jin, Jerome Teysseyre, Xavier Baraton, Pandi C. Marimuthu,
Yoon, Seung Wook, Yaojian Lin, Yonggang Jin, Jerome Teysseyre, Xavier Baraton, and Pandi C. Marimuthu. 2012. “Next Generation eWLB (Embedded Wafer Level BGA): Advanced 3D SiP Packaging Solution.” IMAPSource Proceedings 2012 (DPC): 1507–26. https://doi.org/10.4071/2012DPC-wa22.