Vol. 2015, Issue CICMT, 2015April 01, 2015 EDT
Future Perspective of Materials and Processes of LTCC Technology Beyond Microelectronics Packaging
Future Perspective of Materials and Processes of LTCC Technology Beyond Microelectronics Packaging
Yoshihiko IMANAKA,
IMANAKA, Yoshihiko. 2015. “Future Perspective of Materials and Processes of LTCC Technology Beyond Microelectronics Packaging.” IMAPSource Proceedings 2015 (CICMT): 2–13. https://doi.org/10.4071/CICMT-KEYNOTE2_FUJITSU.