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Ceramics Conference Papers
Vol. 2015, Issue CICMT, 2015April 01, 2015 EDT

A 10 MHz to 80 GHz BGA Transition from Chip to LTCC Interposer for Chip Scale Packages

Bradley A. Thrasher, William E. McKinzie, Deepukumar M. Nair, Michael A. Smith, Allan Beikmohamadi, Elizabeth D. Hughes, James M. Parisi,
LTCC BGA interconnect chip scale package millimeterwave transition
• https://doi.org/10.4071/CICMT-TP14
IMAPSource Conference Papers
Thrasher, Bradley A., William E. McKinzie, Deepukumar M. Nair, Michael A. Smith, Allan Beikmohamadi, Elizabeth D. Hughes, and James M. Parisi. 2015. “A 10 MHz to 80 GHz BGA Transition from Chip to LTCC Interposer for Chip Scale Packages.” IMAPSource Proceedings 2015 (CICMT): 67–72. https://doi.org/10.4071/CICMT-TP14.
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