Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Low Cost Chip Last Fanout Package using Coreless Substrate
Low Cost Chip Last Fanout Package using Coreless Substrate
Chen, Scott, Simon Wang, Coltrane Lee, and John Hunt. 2015. “Low Cost Chip Last Fanout Package Using Coreless Substrate.” IMAPSource Proceedings 2015 (DPC): 272–300. https://doi.org/10.4071/2015DPC-ta24.
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