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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015
January 01, 2015 EDT
System in Package Design Case Study
James Meyer
,
SIP
system in package
flip-chip
•
https://doi.org/10.4071/2015DPC-tp52
IMAPSource Conference Papers
Meyer, James. 2015. “System in Package Design Case Study.”
IMAPSource Proceedings
2015 (DPC): 973–94.
https://doi.org/10.4071/2015DPC-tp52
.
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