Loading [Contrib]/a11y/accessibility-menu.js
Skip to main content
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
EMPC Conference Proceedings (IMAPS Europe)
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015
January 01, 2015 EDT
System in Package Design Case Study
James Meyer
,
SIP
system in package
flip-chip
•
https://doi.org/10.4071/2015DPC-tp52
IMAPSource Conference Papers
Meyer, James. 2015. “System in Package Design Case Study.”
IMAPSource Proceedings
2015 (DPC): 973–94.
https://doi.org/10.4071/2015DPC-tp52
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats
